How to cleverly apply inorganic binders when assembling stamping dies

The most common inorganic binder used in stamping dies is phosphate, and the most common one is phosphoric acid copper oxide binder. The process of using inorganic binder is simple and easy to operate. No special equipment is required, and the requirements for hole processing of stamping die parts can be appropriately reduced. It has sufficient strength after bonding, and the strength of the socket structure is the best, and the shear strength of the socket can reach 80-100 MPa. High temperature resistance, generally up to about 600°C (softening at about 700°C), when an appropriate amount of ferrosilicon or cobalt oxide is added to the copper oxide, the temperature can reach about 1000°C. (1) The preparation of the binding agent first put a little phosphoric acid (such as 10ml)) in a beaker, slowly add S-8g of aluminum hydroxide, stir evenly in the glass, and then add the remaining phosphoric acid (90ml.) to make it thick. Milky, stir and heat to 220-240 degrees to make it light brown. Use after natural cooling. Pour the copper oxide powder (according to the ratio) to the yellow dry copper plate, use a dropper to pour the phosphoric acid solution, slowly mix it with bamboo slices, and it will appear gelatinous after about 2 to 3 minutes, and you can pull out 10 to 20 mm filaments. For bonding, the copper plate is especially suitable for the summer to facilitate the rapid loss of reaction heat. In winter, the glass plate should be used when the room temperature is low to facilitate the maintenance of the reaction heat. (2) The bonding process uses chemical reagents such as acetone or toluene to clean the bonded surface to remove oil stains and rust spots, and install and locate the relevant parts of the die. Spread the adjusted adhesive evenly on each bonding surface. When bonding, the punch can be moved up and down to remove the gas, and finally the bonding is determined. After bonding and curing, it is trimmed by fitter to eliminate excess overflow and can be used after trimming. Use inorganic bonding agent to fix the punch, be sure to prevent the bonding agent from getting wet. Generally, the copper oxide should be baked in a thermostat at 200°C for 0.5~lh before use, and then used after the moisture is discharged. When curing after bonding, it should be cured at room temperature for 2h, and then placed in a thermostat to heat at 60～80℃ for 2～3h before use. Inorganic binders are generally easy to dry, and the dosage should not be adjusted too much at one time, otherwise the drying will be too fast and it is too late to operate. Use phosphoric acid with a density of 1.72g/cm3. Generally, the dosage should not exceed 20g copper oxide at a time. Inorganic binders are brittle when used, so they are not suitable for butt joints, and they are not resistant to acid and alkali. They are mainly not resistant to hydrochloric acid and are slightly soluble in water. In addition, when the bonding gap is small, the machining accuracy of the hole is higher. Previous: How to design the layout of stamping parts and share several common layout drawings